Geoffrey Lee VP of Siemens,

Abstract:

In 2011, Marc Anderssen remarked that “software is eating the world”. While software has been eating the world, AI is now rewriting the entire menu, transforming not just what we consume, but how it's created, served, and experienced.

This transformation is creating unprecedented demand for computational resources, with AI workloads driving exponential growth in compute infrastructure requirements. In response, a new wave of software innovation is emerging to orchestrate, optimize, and manage these increasingly complex computational ecosystems, fuelling unprecedented demand for semiconductors in our software-defined, silicon-enabled global economy.

Organizations worldwide are making substantial investments in software development capabilities to navigate this transformation. However, electronic development teams face formidable challenges: scaling limitations at the physical level, multi-domain design complexities, fragmented data links across system integration layers, and a thinning engineering workforce amidst growing talent scarcity.

Successfully addressing these obstacles requires leverage of a comprehensive digital twin that goes beyond simulation and embraces a multi-faceted approach: implementing production-grade AI tools, establishing robust requirements capture methodologies, and enabling seamless software/hardware co-design processes. As traditional chip scaling approaches physical constraints, advanced packaging technologies like chiplets and 3D IC design workflows become essential. Cross-domain data management within the silicon lifecycle must connect with broader platforms while preserving domain-specific insights. Strategic partnerships with foundries and service providers round out this comprehensive strategy for enabling responsive, software-driven design processes.